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(Click on thumbnails for larger view)
CONSTRUCTION:
Single Sided, Double Sided, Multi-Layer, Metal, Flex and Rigid-Flex
SUBSTRATE MATERIALS:
We offer all rigid and flexible substrates
SMALLEST HOLE:
.0039 (.062 thick board)
SMALLEST TRACK: .004
BLIND & BURIED VIAS: Yes
AVAILABLE FINISH:
Lead Free Hot Air Solder Leveled (HASL) Immersion Silver, Immersion Gold, Hard Gold Plate, Electroplated Soft Gold (for Gold Wire Bonding) and Tin Lead Solder (HAL)
Regardless of what you need, FR4 so thin you can see through it, up to (20+) multi layers selectively soft gold plated for wire bonding, blind and buried vias, metal substrates, large scale multi-layer flex circiuts or rigid-flex circuits, we do it all.
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