Red, Blue and Green of course...
but isn't it nice to be able to choose from so many other colors?
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Argus International’s 9724 makes handling WET Panels a thing of the past !
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Solder mask thickness & Track Encapsulation and Coverage Ink deposit around tracks and pads is a key to process capability. The Argus spray unit is able to cover tracks up to 12-15 mils. thick with a single coat. Spray solder masks properties are optimized to prevent slumping from the track-edges. Argus Spray technology allows encapsulation below 4 mil track /gap configuration. The spray process permit very high levels of thixotropy resulting in excellent track coverage.
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Approximate thickness of the mask is 2 mil – 2.5 mil over most of PCB and the thickness between tracks is minimized.
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Excellent encapsulation up to 400 micron copper capability.
How does the 9724 deal with LPISM in the barrels? LPISM in the barrels is a significant problem in silk screen application methods. Because the silk screen squeegee forces LPISM into the holes, higher developer pressure is required to obtain clear holes. Spray coating with the 9724 does not result in significant amounts of LPISM in the barrels, because the mask is not forced into the holes as the squeegee does; therefore, lower developer pressure is used, and process speed is improved. LPISM dams between fine pitch patterns are more easily held, under-cut during development is reduced and surface cosmetics are improved because proper developing procedure can be maintained.
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